-1.00mm centerline pitch.
-Discrete wire interconnect available in wire to board.
-(SMT) Surface mount technology design
-Available in semi gold plating.
-UL94V-0 rated housings material.
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-1.00mm centerline pitch.
-Discrete wire interconnect available in wire to board.
-(SMT) Surface mount technology design
-Available in semi gold plating.
-UL94V-0 rated housings material.